Bangalore: Intel has announced the availability of XMM 2138 platform for Dual-SIM and Dual-Standby (DSDS) operation.
The platform is based on X-GOLD 213 EDGE baseband chip, which being a low-cost single chip solution, offers cost-effective solution for the dual-SIM market. The X-GOLD 213 EDGE for mobile internet brings in integration of GSM baseband, RF transceiver, mixed signal, power management, SRAM and FM radio in 65nm CMOS technology. The 8x8 mm eWLB-217 lead-free package of the X-GOLD 213 allows compact and slim feature rich designs. According to Dr. Hermann Eul, President, Intel Mobile Communications, with the cost-effective platform, Intel has shown its commitment towards providing solutions to all the market segments ranging from smartphones to low-cost models. Recently at MWC Intel has also demonstrated its OS Meego for tablet and smartphones.
XMM 2138 enables delivery of the same performance by using just one transceiver. This is one of the reasons of it being a cost-effective as generally the dual-SIM handsets come with two transrceivers.
The platform is available in two types- UTA-based XMM 2138 platform which offers Tier 1 customers with reuse and design flexibility and turnkey platform which helps mobile phone manufacturers in producing optimized and cost-effective products. This will in turn help in catering to the increasing demand for Dual-SIM handsets.
Along with this, the DSDS platform also supports WQVGA displays and touchscreens, WLAN for internet connectivity and Bluetooth. Other features include ARM11 core in the X-GOLD 213, chip-integrated FM radio providing high audio and video performance. At present the XMM 2138 platform is available for commercial distribution.
Few days back, Intel has also announced that it has started shipping of XMM 6260 platform for 3G smartphones.
The platform is based on X-GOLD 213 EDGE baseband chip, which being a low-cost single chip solution, offers cost-effective solution for the dual-SIM market. The X-GOLD 213 EDGE for mobile internet brings in integration of GSM baseband, RF transceiver, mixed signal, power management, SRAM and FM radio in 65nm CMOS technology. The 8x8 mm eWLB-217 lead-free package of the X-GOLD 213 allows compact and slim feature rich designs. According to Dr. Hermann Eul, President, Intel Mobile Communications, with the cost-effective platform, Intel has shown its commitment towards providing solutions to all the market segments ranging from smartphones to low-cost models. Recently at MWC Intel has also demonstrated its OS Meego for tablet and smartphones.
XMM 2138 enables delivery of the same performance by using just one transceiver. This is one of the reasons of it being a cost-effective as generally the dual-SIM handsets come with two transrceivers.
The platform is available in two types- UTA-based XMM 2138 platform which offers Tier 1 customers with reuse and design flexibility and turnkey platform which helps mobile phone manufacturers in producing optimized and cost-effective products. This will in turn help in catering to the increasing demand for Dual-SIM handsets.
Along with this, the DSDS platform also supports WQVGA displays and touchscreens, WLAN for internet connectivity and Bluetooth. Other features include ARM11 core in the X-GOLD 213, chip-integrated FM radio providing high audio and video performance. At present the XMM 2138 platform is available for commercial distribution.
Few days back, Intel has also announced that it has started shipping of XMM 6260 platform for 3G smartphones.
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